DISCO 為全球最大半導(dǎo)體劃片，磨片，拋光加工設(shè)備供應(yīng)商。迪思科科技（中國(guó)）有限公司為其在華的全資子公司。

本公司現(xiàn)有專(zhuān)業(yè)的現(xiàn)場(chǎng)服務(wù)工程師、工藝開(kāi)發(fā)工程師超過(guò)80 名、并在上海、蘇州、北京、天津、成都、深圳、大連、西安、惠州、廈門(mén)及武漢設(shè)有分公司或辦事處, 實(shí)現(xiàn)了中國(guó)大陸半導(dǎo)體產(chǎn)業(yè)發(fā)達(dá)地區(qū)的全面覆蓋。

本公司在上海總部配備有 DGP8761、DFD6362 、DFD6340 、DFL6560 、DAD3650 、,DAD3350、DAD322、DFG8540、DFL7020 等供工藝開(kāi)發(fā)和人員培訓(xùn)的設(shè)備。

DISCO 總公司連續(xù)11年獲得Intel 公司的最佳供應(yīng)商獎(jiǎng)，全球僅此一家。本公司作為DISCO全資子公司，也獲得了Intel 在華分公司的高度評(píng)價(jià)與認(rèn)可。三星、海太、華潤(rùn)、天水華天等多家國(guó)內(nèi)外半導(dǎo)體制造企業(yè)也對(duì)本公司的產(chǎn)品質(zhì)量和售后服務(wù)都有良好評(píng)價(jià)，并成為本公司的忠實(shí)客戶(hù)。

以下就幾款設(shè)備作一些簡(jiǎn)單介紹：

The DAD3650 is a manual dicer with facing dual spindles having high throughput and compact footprint.

Advantages:

High Throughput Compact Footprint Process ability Operability□Reduced process time by using a dual cut□High speed X,Y and Z-axes□Distance between blades:24 mm□World's smallest dual dice□8"/250 mm sq.work piece capable□Handles various dual spindle applications□Color touch panel+GUI□Automatic alignment installed as standard

The DFD6560 is a fully automatic dicer for準(zhǔn)300 mm wafers, featuring a space-saving layout ideal when installing multiple units in the same area.

Advantages:

Space saving Improved throughput Optional measures to eliminate particles User friendliness□16%smaller footprint than the DFD6362□Concentrated front access□Eliminates the need for side maintenance areas□Built-in optional units□Thin-type 20 mm wheel cover□Atomizing nozzle cleaning□Function to prevent drying and adhesion□Graphical display enabling Intuitive operation□Kerf check error recovery□MTBA status display

The DFL7161 is a fully automatic laser saw with support for 準(zhǔn)300mm wafers, which improves the productivity and reliability.

Advantages:

Improved throughput Shortened MTTR Ease of use Major applications□Independent coater and spinner□Improved high acceleration speed of the X-axis□Dedicated optical system for grooving,BSS6 installed□Improved laser monitoring function□Operation screen mode added□Low-k grooving□Si full cut

The DAS8930 is a semi-auto surface planer which is simple and compact. Optional for R&D,small production, multiple work piece processing.

Advantages:

Targets Unit configuration Operability□Ultra precision cutting process which diamond bit is used□Biggest wafer size 準(zhǔn)300 mm□Thickness variation within a wafer≦3.0 μm□Surface roughness of bump(Rz)≦□Compact semi-auto device□1 axis 1 chuck table□Wafer thickness measuring part loaded□2.0 kW spindle□DISCO's operation common to grinders which is convenient to use□Safety(obtained CE,conforms to Semi S2-0703 or S8-1103)