Hu Henghua Meeting with Zhuang Zhengsong， Global Vice President of Hewlett-Packard （HP）

On August 24， Hu Henghua， Deputy Secretary of CPC Chongqing Municipal Committee and Mayor of Chongqing Municipal Government met with Zhuang Zhengsong， Global Vice President of HP and President of HP Greater China Region， and jointly witnessed the launch of HP’s Global Innovation Initiative—HP Advanced Technology Research and Development （R&D） Action and the signing of an agreement on the platform that integrates industry， academia and research.

Zhou Xinhong， Vice President of China HP Co.， Ltd.， Zheng Hong， Vice President of HP Greater China Region， Jiang Duntao， Vice Mayor of Chongqing Municipal Government， and Shu Lichun， Secretary of the CPC Committee of Chongqing University attended the event.

On behalf of the Chongqing Municipal Government， Hu Henghua thanked the long-term contribution made by HP and introduced Chongqing’s endeavors in promoting the implementation of national key strategies， building the “33618” System for Modern Manufacturing Clusters， fostering a Digital Chongqing， and developing electronics and IT manufacturing. He hoped that HP will maintain Chongqing as its main production base， increase orders in Chongqing， accelerate the R&D of new products， attract more supplies， and engage in coordinated innovation to advance the growth of industrial chains.

Zhuang Zhengsong noted that HP will leverage its own strength in technology and resources to optimize strategic layout， support the development of the electronics and IT manufacturing in Chongqing， and actively contribute its share to building a modern new Chongqing.

After the meeting， HP signed a strategic cooperation agreement on the platform that integrates industry， academia， and research with Chongqing University. The two sides will engage in cooperation in various areas including the building of an innovation laboratory for artificial intelligence applications， the development of new alloy materials and processes， talent cultivation， and exchanges.

Representatives from HP， Chongqing University， relevant municipal departments， and Xiyong Micro-Electronics Industrial Park attended the event.

8月24日，市委副書記、市長胡衡華會見了惠普全球副總裁兼大中華區(qū)總裁莊正松一行，并共同見證惠普全球創(chuàng)新行——惠普先進技術研發(fā)行動啟動暨產學研平臺簽約活動。

中國惠普有限公司副總裁周信宏、惠普大中華區(qū)副總裁鄭紅，副市長江敦濤，重慶大學黨委書記舒立春參加。

胡衡華代表市政府感謝惠普公司長期以來對重慶發(fā)展作出的貢獻，介紹了重慶推動國家重大戰(zhàn)略實施、打造“33618”現(xiàn)代制造業(yè)集群體系、推進數(shù)字重慶建設和電子信息制造產業(yè)發(fā)展情況，希望惠普公司繼續(xù)把重慶作為全球主要的生產基地，將更多訂單放在重慶，加快新產品研發(fā)，引入更多配套企業(yè)，開展協(xié)同創(chuàng)新，帶動產業(yè)鏈發(fā)展。

莊正松表示，惠普公司將立足自身技術與資源優(yōu)勢，不斷優(yōu)化戰(zhàn)略布局，助力重慶電子信息制造業(yè)發(fā)展，為現(xiàn)代化新重慶建設貢獻力量。

會見活動后，惠普公司與重慶大學簽訂了產學研平臺戰(zhàn)略合作協(xié)議，雙方將著力在人工智能應用聯(lián)合創(chuàng)新實驗室建設、新型合金材料及工藝開發(fā)、人才培養(yǎng)與交流等方面開展合作。

惠普公司，重慶大學，市有關部門、西永微電園負責人參加。